CHIP STRUCTURE AND WIRE BONDING PROCESS SUITED FOR THE SAME

摘要

A chip structure having a chip, an adhesion layer, and a metal layer. The chip has an active surface and many conductive pads. The conductive pads are disposed on the active surface, wherein the conductive pads are made of copper. The adhesion layer is directly formed on the conductive pads, wherein the material of the adhesion layer includes copper. The metal layer is formed on the adhesion layer, wherein the material of the metal layer includes copper.