| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a COB mounting semiconductor device and a semiconductor module, which can reduce a cost, manufacturing time, and size, in the COB mounting semiconductor device in which a semiconductor element is directly mounted on a circuit board, and a semiconductor module including the semiconductor device. SOLUTION: This semiconductor device comprises a semiconductor element 106 mounted on a circuit board 101, wiring 102 formed on the surface of the circuit board 101, and conductors 107 for connecting the semiconductor element 106 to the wiring 102, and the manufacturing method of the semiconductor device comprises a process for arranging dams 109 formed of a high heat contractive material on the surface of the circuit board 101 to define a region including the semiconductor element 106, the conductors 107, and portions of the wiring 102 which are connected to one-side ends of conductors 107, a process for introducing a sealant 110 to the region defined by the dams 109 and sealing the semiconductor element 106, the conductors 107, and portions of wiring 102 which are connected to one-side ends of the conductors 107 with the sealant 110, and a process for peeling the dams 109 by cooling the dams 109. COPYRIGHT: (C)2004,JPO
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