| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and method for mounting electronic component in which high speed operation is ensured by simplifying the structure of a mounting head and the work efficiency can be enhanced by eliminating the coating work by the mounting head. SOLUTION: In the electronic component mounter for mounting a chip 6, being fed to an electronic component feeding section 2 while directing the bump forming face upward, on a board after coating the chip 6 with flux, a holding head 74 received the chip 6 taken out from a viscous sheet 5 by means of a mounting head 33 is inverted with respect to a stage 79 spread with flux 80 in order to coat the bumps of the chip 6 with flux and to flatten the bumps. After the holding head 74 is returned back to the original position, the chip 6 arranged on the stage 79 is mounted on a take-out board by means of the mounting head 33. The structure can be simplified by limiting the function of the mounting head 33 only to transfer motion. COPYRIGHT: (C)2004,JPO
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