DRY ETCHING METHOD AND DRY ETCHING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide dry etching method/device for reducing reaction products bonded to an equalized ring disposed in a vacuum vessel. SOLUTION: An electrode ring whose diameter is larger than that of a substrate electrode with which a substrate is placed in the vacuum vessel can be arranged at the periphery of the substrate electrode. COPYRIGHT: (C)2004,JPO