| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition with which a through hole of a printed board of high aspect ratio and a small diameter is filled up with no defect, and to provide a method for filling a hole of a printed board with the resin composition. SOLUTION: Mixed composition of 80-98 parts (1) of cyanate ester compound and/or pre-polymer thereof and epoxy resin in liquid form at room temperature, and radical polymerization monomer and/or oligomer of 2-20 parts (2) are comprised. A total of (1) and (2) is 100 parts. The composition for filling a through hole further comprises optical radical initiator of 0.05-3 parts, thermoset catalyzer 0.01-3 parts and filler of 50-400 parts. After the through hole is filled with the composition for filling the through hole, it is thickened by irradiating with UV, and then cured by heating. COPYRIGHT: (C)2004,JPO
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