| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that improvement of mounting density may increase feed losses and to reduce the cost of entire antenna sub-system, in a high-frequency circuit device provided on a multilayer dielectric substrate. <P>SOLUTION: Two layers of build-up layers 13 are laminated on each of three-layer laminated substrate (BT resin) 12 having a thickness of 0.1 mm for each layer, totalling seven layers (e.g. eight-layer conductive layer 2) to form a multilayer dielectric substrate 3. The actually measured thickness of the substrate 3 is 1.0 mm. In this substrate 3, the layer 2 consisting of multiple layers (eight layers) is provided only in a region A in a Fig. 1 (reference numeral 4 in the figure), and the layer 2 is not provided in a region B (reference numeral 5 in the figure) in an intermediate layer in the substrate. A strip line 1 is provided on the uppermost layer in the region A, and a ground conductor pattern is provided on the second layer therebelow to form a transmission line. Also, a distribution circuit and a control line are arranged highly densely by using the other conductive layers. <P>COPYRIGHT: (C)2004,JPO |
