| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer polishing equipment wherein adjustments of ring pressure and plate pressure are facilitated and polishing conditions can be changed with superior workability. <P>SOLUTION: This polishing equipment is provided with a first pressure chamber 34 formed between a head body 12 and a holding plate 18, a second pressure chamber 35 formed between the head body 12 and a retainer ring 20, a first regulator 40 which is connected with the first pressure chamber 34 and a pressure source 44, a second regulator 41 which is connected with the second pressure chamber 35 and the pressure source 44, and a control part 46 which controls the first regulator 40 and the second regulator 41 in such a manner that the ratio between retainer pressure as pressure wherein the retainer ring 20 presses an abrasive pad 2 and plate pressure as pressure wherein the holding plate 18 presses the abrasive pad 2 via the wafer can be switched among a plurality of steps of setting pressure ratios which are previously set. <P>COPYRIGHT: (C)2004,JPO |
