| 摘要 |
PROBLEM TO BE SOLVED: To provide a simplified and effective method of inspecting misregistration of a multilayer wiring board. SOLUTION: The method is capable of inspecting misregistration of the multilayer layer wiring board 102 which may be obtained by laminating at a time a plurality of circuit substrates, each of which is provided with a conductive circuit, an insulation layer and a conductive post connected with a conductive circuit through the insulation layer. This method of inspecting misregistration of the multilayer wiring board 102 is characterized by determining misregistration through the electrical conductivity between a misregistration inspection post 100 formed on the circuit substrate surface and a misregistration inspection land 101 which is punched in the area larger than the cross-section of the misregistration inspection post 100 formed on the circuit substrate surface opposing to such post. COPYRIGHT: (C)2004,JPO |
