| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure capable of forming a small and highly reliable semiconductor mounted module by mounting a semiconductor bare chip on one surface of a circuit board in a flip chip mounting manner and a semiconductor component on the other surface by soldering. <P>SOLUTION: The semiconductor bare chip 4 is mounted on one surface of the circuit board 1 in a flip chip mounting manner, and the semiconductor component 9 is formed on the other surface of the circuit board 1. In a case of seeing through the surface of the circuit board 1 from above in a vertical direction, the semiconductor bare chip 4 is nearly included inside the semiconductor component 9 mounted by soldering or the semiconductor component 9 mounted by soldering is nearly included inside the semiconductor chip 4. <P>COPYRIGHT: (C)2004,JPO |
