发明名称 |
SEMICONDUCTOR PACKAGE HAVING MULTI-SIGNAL BUS BARS |
摘要 |
A fabrication method and semiconductor package provide enhanced performance. The semiconductor package includes a semiconductor die having an integrated circuit (IC), and a substrate having a die side coupled to the IC. A plurality of multi-signal bus bars is coupled to a socket side of the substrate such that the bus bars enable I/O signals to be transported between the substrate and a socket. |
申请公布号 |
WO03043084(A3) |
申请公布日期 |
2003.10.02 |
申请号 |
WO2002US34205 |
申请日期 |
2002.10.24 |
申请人 |
INTEL CORPORATION |
发明人 |
GATES, TIMOTHY;STONE, BRENT |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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