Circuit module assembly having an edge-attached vented cover and method for edge-attaching

摘要

A circuit module assembly having an edge-attached vented cover and method therefor provides packaging for memory modules and other circuit modules. A vented cover is attached to a circuit carrier having electrical connections on a back side and an encapsulated integrated circuit die on a front side. Adhesive film is placed on a lower edge of the vented cover and the vented cover is attached to the carrier by applying pressure. A vent in the vented cover and a gap in the adhesive film provide an escape path for air that would otherwise be entrapped between the vented cover and the carrier. Multiple vents may be used to provide more airflow and vents may be positioned at the sides of the circuit carrier to minimize the impact of gaps in the adhesive.