| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the need for exchange of an attaching/detaching head due to the change in the size of an IC by detachably mounting a centering tool to an attaching/detaching head. SOLUTION: When an operation is initiated, a tray-carrying device 17 carries a tray 4 to a tray catch 15 and two substrates 1 are carried onto a substrate table 20. Then, an attaching/detaching head 25 is moved onto the substrate 1, sucks an IC 13 after testing, and carries it to a tentative-placement table 31. Then, it moves onto the tray 4, sucks the IC 13 before testing, connects it to an empty socket 1A, and carries the IC 13 on the same substrate 1 to the tray 4. This procedure is repeated. After the IC 13 before testing is connected 16 all sockets 1A of the substrate 1, the IC 13 is exchanged with the IC 13 before testing after the testing of the next substrate 1 by inverting the substrate table 20. In this case, when the size of the IC 13 is changed, the attaching/detaching head 25 moves onto a centering tool stocker 28 since the centering tool 27 is detachably mounted to the attaching/detaching head 25 and the centering tool 27 is exchanged automatically to cope with the size of the IC 13. |
