发明名称 |
Implantable medical electronics using high voltage flip chip components |
摘要 |
An implantable medical device having reduced volume includes a high voltage die mounted to a substrate and assembled into a device body. The die is flip chip mounted, reducing the size of the substrate and of the device. A high voltage implantable medical device such as an implantable cardio defibrillation device or a hybrid device has a high voltage flip chip die mounted to a substrate containing implantable medical device circuitry to operate with the high voltage flip chip.
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申请公布号 |
US6626931(B2) |
申请公布日期 |
2003.09.30 |
申请号 |
US20000748598 |
申请日期 |
2000.12.26 |
申请人 |
MEDTRONIC, INC. |
发明人 |
MILLA JUAN G.;BOONE MARK R. |
分类号 |
A61N1/02;A61N1/375;A61N1/39;(IPC1-7):A61N1/00 |
主分类号 |
A61N1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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