METHOD FOR SURFACE MOUNTING OF ELECTRONIC COMPONENTS ON PRINTED CIRCUIT BOARD

摘要

FIELD: processes for surface mounting of electronic components on printed circuit boards in electronics and radio engineering. SUBSTANCE: method comprises steps of charging electronic components into accumulators while taking into account arrangement of their wire leads relative to orientation of lands of printed circuit boards; taking electronic components out of accumulators and transferring to zone for mounting them on printed circuit boards; welding wire leads at using successive discharge of capacitor gangs increasing according to linear law; at welding process performing continuous remote non-destruction quality control of each welded joint due to evaluation of intensity of infrared irradiation from welding zone with possibility of correcting welding modes depending upon state and geometry of welded surfaces; welding wire leads of electronic components to lands of printed circuit board by means of three welding electrodes forming two pairs of doubled electrodes arranged in mutually normal planes. EFFECT: enlarged manufacturing possibilities of mounting method, enhanced efficiency.