| 摘要 |
Pack blister and card assembly procedure in which a blister (2) with two main surfaces and one or more bubbles for a product is assembled with a card (3) having holes for the bubbles, has stages in which the blister and card are pressed together and treated to ensure thermal adhesion. Pack blister and card assembly procedure in which a blister (2) with two main surfaces and one or more bubbles for a product is assembled with a card (3) having holes for the bubbles, has stages in which the blister and card are pressed together and treated to ensure thermal adhesion. The pressure and adhesion stages are carried out with the blisters and cards moving together, with the blister placed on one side of the card and a second side (4) with holes is folded over the blister and fixed in place by an induction process using electrodes (71) and counter-electrodes (19).
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