| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a device and a method for stripping a protective tape from a semiconductor wafer stably. <P>SOLUTION: The tape stripping device strips a protective tape from a semiconductor wafer after the protective tape 15 is pasted to a semiconductor wafer 11 and the back side of the semiconductor wafer is ground. The tape stripping device comprises a stage 12 for holding and securing the semiconductor wafer 1, a hole 12a formed in the stage, a finger 13 disposed in the hole and moving in the direction projecting from the semiconductor wafer holding face of the stage, and a strip roller 14 for pasting a strip tape 16 to the protective tape and then guiding the strip tape so as to strip the tape from the semiconductor wafer along with the strip tape. <P>COPYRIGHT: (C)2003,JPO</p> |
