| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit device having a semiconductor element with electrodes on its both sides which is small-sized, exhibits a high heat dissipation performance and whose resistance and floating inductance can be reduced, and to provide its manufacturing method. SOLUTION: The floating inductance, conduction resistance and the like can be reduced and the circuit device can be downsized by using protruded electrodes 212, metal pieces 214 and the like in place of conventional wires for electrical connection between the semiconductor elements 211 and a circuit board 215. Further, the heat dissipation from the semiconductor elements 211 can be increased as compared to the conventional way by packing the metal pieces 214 and the semiconductor elements 211 with a molded insulating resin material 216 for integrating the circuit board 215, insulating resin material 216 and heat dissipation member. COPYRIGHT: (C)2003,JPO |
