| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem that heat generated at a semiconductor element operating time cannot be externally efficiently dissipated and a thermal breakage occurs in the element. <P>SOLUTION: A package for housing a semiconductor element comprises a base having a placing part for placing the element on an upper surface, a frame-like insulator mounted to surround the placing part on the base, and a cover mounted on the insulator for hermetically sealing the inside of the insulator. In this package, the base is formed by impregnating a base obtained by knitting carbon fibers in a three-dimensional manner with copper. <P>COPYRIGHT: (C)2003,JPO</p> |
