| 摘要 |
PROBLEM TO BE SOLVED: To avoid that heat being generated from an electrical heating component that is packaged on a board becomes constraints when constructing control program of a system in equipment requiring airtightness. SOLUTION: In a radiation structure in the airtight equipment whose inside has the board 50 where an electronic component is packaged, the heat electronic component 51 is thermally connected to the electronic component 52 having thermal conductivity via patterns 70 and 71. In that case, a middle section of the pattern is formed at a lower portion of the heating electronic component 51, and also one end section is bonded to an electronic component 60 having the thermal conductivity. COPYRIGHT: (C)2003,JPO
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