| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve thinness and reliability for a semiconductor device using a lead frame. <P>SOLUTION: A semiconductor device includes a lead 20 which has a first and a second part 22 and 24, a semiconductor chip 30 which is electrically connected to the first part 22 through a wire 34, and a sealing part 40 which covers at least one part of the semiconductor chip 30 and which supports the lead 20. The sealing part 40 is provided on the surface side where the wire 34 of the first part 22 is formed. The lead 20 bends toward the side of the sealing part 40 at the part which extends to the outer side of the sealing part 40 from the first part 22, and the second part 24 is located at the opposite side of the first part 22 side of the sealing part 40. <P>COPYRIGHT: (C)2003,JPO</p> |
