发明名称 LEAD WIRE FOR ELECTRONIC COMPONENTS AND METHOD FOR MANUFACTURING THE SAME
摘要 PURPOSE: A lead wire is provided to prevent a harmful pollution to human beings and environments and meet the characteristics by avoiding lead component as a coating layer. CONSTITUTION: A coating layer is an Sn-Bi alloy layer(40) mixed with Sn and Bi in a ratio of 87-97%: 3-13%. A Sn layer(30) inside the Sn-Bi alloy layer(40) is further formed to form a coating layer. The Sn layer(30) is coated around the peripheral surface of a wire(10) before forming the Sn-Bi alloy layer(40), thereby preventing a harmful pollution with respect to human beings and environments and meeting the characteristics by avoiding a lead component as the lead wire is coated.
申请公布号 KR20000025186(A) 申请公布日期 2000.05.06
申请号 KR19980042161 申请日期 1998.10.09
申请人 HWANG, DU HYUN 发明人 HWANG, DU HYUN
分类号 H01G4/228 主分类号 H01G4/228
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