| 摘要 |
PROBLEM TO BE SOLVED: To provide a dielectric resin material satisfactorily having mechanical characteristics suitable for a circuit member, especially for a millimeter-wave device which is used in a frequency band of≥50 GHz, and to provide the circuit member. SOLUTION: This dielectric resin material is used for the circuit member which utilizes electrical radiation of a frequency of≥50 GHz, wherein the resin material has a coefficient of water absorption of≤0.01% and a coefficient of thermal expansion of≤7×10<SP>-5</SP>, and comprises an amorphous synthetic resin. The circuit member is molded by using the resin material. COPYRIGHT: (C)2003,JPO |
