| 发明名称 |
Method of recovering lead-free solder from printed circuit boards |
| 摘要 |
Discarded printed circuit boards are sorted according to the alloying elements in solder used on the printed circuit boards. After sorting, the printed circuit boards are heated to melt the solder, and the molten solder is collected.
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| 申请公布号 |
US2003178470(A1) |
申请公布日期 |
2003.09.25 |
| 申请号 |
US20020103572 |
申请日期 |
2002.03.22 |
| 申请人 |
TADA SAKARI;HASEGAWA EIETSU |
发明人 |
TADA SAKARI;HASEGAWA EIETSU |
| 分类号 |
B23K1/018;C22B7/00;H05K1/02;H05K3/34;(IPC1-7):B23K31/02 |
主分类号 |
B23K1/018 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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