发明名称 |
FLAME-RESISTANT AND LOW DIELECTRIC RESIN COMPOSITION, AND MOLDED PRODUCT, PREPREG AND CIRCUIT BOARD USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a flame-retardant and low dielectric resin composition having a low dielectric constant and a dielectric loss in a high frequency region, excellent flame retardance and superior processability such as in sheet forming. SOLUTION: This flame-retardant and low dielectric resin composition comprises a heat-resistant and low dielectric graft copolymer (P-1) having a multiphase structure composed of a nonpolarα-olefin (co)polymer segment and/or a nonpolar conjugated diene (co)polymer segment and an aromatic vinyl (co)polymer, and at least one flame retardant selected from a phosphorus based flame retardant (FR-a) or an inorganic flame retardant (FR-b). When either of the flame retardants is used, the resin composition comprises 0.1-30 parts (mass) of the phosphorus based flame retardant or 0.5-80 parts (mass) of the inorganic flame retardant based on 100 parts (mass) of the graft copolymer. When both flame retardants are used, 0.1-30 parts (mass) of a total amount of the flame retardants are used. A molded product such as a film and a circuit board are provided by using the same. COPYRIGHT: (C)2003,JPO
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申请公布号 |
JP2003268189(A) |
申请公布日期 |
2003.09.25 |
申请号 |
JP20020074091 |
申请日期 |
2002.03.18 |
申请人 |
NOF CORP;TDK CORP |
发明人 |
OTA TOSHIHIRO;YAMADA TOMIO;ITO TETSUYA;ASAMI SHIGERU |
分类号 |
C08J5/18;B32B15/08;B32B27/18;B32B27/28;C08J5/04;C08K3/00;C08K3/32;C08K5/49;C08L51/00;H05K1/03;(IPC1-7):C08L51/00 |
主分类号 |
C08J5/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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