| 摘要 |
<p>Major surface (21A) of a substrate (21) having an optical waveguide (22) and a modulation electrode is pasted to a base substrate (41) through a thermosetting resin, and then the rear surface (21B) of the substrate (21) is machined thus making thin the entirety. Subsequently, the rear surface (21B) of the substrate (21) thus rendered thin is subjected to machining or laser machining to form a thin part (28), which is further subjected to machining or laser machining to form a first thin part (26) at a part, including the optical waveguide (22), of the thin part (28) and a second thin part (27) thinner than the first thin part (26) contiguously thereto. Thereafter, the rear surface (21B) of the substrate (21) is pasted to the major surface (31A) of a supporting substrate (31) through a thermosetting resin and the base substrate (41) is stripped thus obtaining an optical modulator (30).</p> |
