| 摘要 |
A substrate bonding apparatus includes a bonding chamber, lower and upper stages positioned at lower and upper spaces at an interior of the bonding chamber, respectively, the lower stage including a first receiving part, a first lifting system having a first support part for supporting a first substrate, the first receiving part receiving the first support part within the lower stage, and a blowing system formed in the first support part to blow air through the first support part.
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