| 摘要 |
Optical semiconductor device, characterized in that it comprises a semiconductor component (2), one front face of which has an optical sensor (3), a transparent plate (6), a rear face of which has electrical connection tracks or lines (8), attachment means (5,10,11) in order to attach the front face of the said semiconductor component to the rear face of the said transparent plate, electrical connection means (5) in order to electrically connect the said semiconductor component to the said electrical connection lines, and encapsulation means comprising a material for encapsulating the said connection means (5) and the periphery of the said semiconductor component (2) on the rear face of the said transparent plate (6), so as to form a peripheral sealing ring (11) between the said semiconductor component and the rear face of the said transparent plate, the said electrical connection lines (8) lying under the said sealing ring and outside the latter. |
