| 摘要 |
A package for optical devices comprises a substantially flat lid on which an optical device is mounted. The optical device is preferably soldered to a pedestal of the lid and then wirebonded to electrical connections on the lid. Electrical energy and signals are supplied through the wirebonding to the optoelectronic device enabling the optical fibers to be actively aligned with the optoelectronic device. The device is tested and characterized. If the device fails the characterization test, it is easily replaced before the package is assembled. The cap includes a cavity of sufficient size to fit over the components mounted onto the lid. The cap is placed over the components and sealed with the lid to form a protective package that may be hermetic, near hermetic, or non-hermetic. The lid and cap are manufactured inexpensively using techniques such as electrochemical etching and embossing. <IMAGE> |
