发明名称 |
Cover structure for electronic device and method of manufacturing same |
摘要 |
A cover structure for an electronic device includes a plastic cover, an aluminum or aluminum alloy layer on the plastic cover, and an oxide layer of aluminum or aluminum alloy on the aluminum or aluminum alloy layer. A method of manufacturing the cover structure includes: (1) injection molding the plastic cover; (2) forming the aluminum or aluminum alloy layer on the plastic cover; and (3) anodizing the aluminum or aluminum alloy layer to form an oxide layer thereof. The method also can include a step of coloring the oxide layer of aluminum or aluminum alloy. The cover structure thus formed has a metallic appearance with decorative colors or patterns, and is resistant to corrosion. The cover structure is not only very aesthetically pleasing to users but also durable.
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申请公布号 |
US6623614(B2) |
申请公布日期 |
2003.09.23 |
申请号 |
US20010028566 |
申请日期 |
2001.12.20 |
申请人 |
HON HAI PRECISION IND. CO., LTD. |
发明人 |
HSU CHE-YUAN |
分类号 |
B32B15/08;B29C59/00;B32B9/00;C23C28/00;C25D5/34;C25D5/56;(IPC1-7):C25D5/56 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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