发明名称 Methods for analyzing the effectiveness of wafer backside cleaning
摘要 A method for using a monitor substrate to determine effectiveness of a cleaning operation is provided. The method includes selecting a substrate from a lot of substrates and inspecting a surface of the substrate to determine a roughness profile of the substrate. The monitor substrate is then processed through a cleaning operation, and the monitor substrate is patterned with die regions throughout. Each of the die regions has a plurality of areas defining distinct roughness simulations. The method the proceeds to inspecting the monitor substrate at one die region and at one of the plurality of areas in the one die region that most closely resembles the roughness profile of the substrate. The inspecting of the monitor substrate is configured to yield data regarding cleaning performance of the cleaning operation.
申请公布号 US6624078(B1) 申请公布日期 2003.09.23
申请号 US20020196849 申请日期 2002.07.15
申请人 LAM RESEARCH CORPORATION 发明人 RAVKIN MICHAEL
分类号 H01L21/461;H01L23/544;(IPC1-7):H01L21/461 主分类号 H01L21/461
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