发明名称 CERAMIC ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a ceramic electronic component in which a sheet attack can be prevented and a structure defect such as short circuit failure and withstand voltage failure is hard to be generated. SOLUTION: First ceramic layers 110 are adjacent to one surface side of internal electrodes 21, 22, and second ceramic layers 120 are adjacent to the other surface side of the electrodes. Average grain diametersα1,α2 of the first and second ceramic layers 110, 120 and thickness T1, T2 of the layers satisfy relations ofα1≤α2, 0.05<α1≤0.35μm, T1<T2 and 0<T1<1.5μm. The combination of the first ceramic layer 110, the internal electrodes 21, 22 and the second ceramic layer 120 is formed into one set. A plurality of sets are laminated in order in a relation that the first ceramic layer 110 and the second ceramic layer 120 are adjacent to each other. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003264120(A) 申请公布日期 2003.09.19
申请号 JP20020062711 申请日期 2002.03.07
申请人 TDK CORP 发明人 KOBAYASHI AKIRA;UEDA KANAME;SENBU YASUSHI;ISHIDA KAZUSHI;SAITO AKIRA
分类号 H01G4/30;(IPC1-7):H01G4/30 主分类号 H01G4/30
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