| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board laminate which has excellent, adhesion, a wiring circuit profile and an excellent interline insulating characteristic even in a polymer substrate having a smooth surface when a high-density circuit is formed on the polymer substrate by using a semi-additive method, and also has an excellent dielectric characteristic, a low linear expansion property and a high glass transfer temperature. SOLUTION: A laminate is provided with a metal layer on one surface of a polymer film and an adhesive layer on the other surface. In a printed wiring board laminate, in the whole structure body composed of the polymer film and an adhesion layer formed on one surface thereof, a relative dielectric constant is 3.5 or less, a dielectric tangent 0.02 or less, a thermal expansion coefficient 40 ppm or less and a glass transfer temperature 150°C or more. COPYRIGHT: (C)2003,JPO |
