METHOD AND APPARATUS FOR FABRICATING STACKED SEMICONDUCTOR CHIP PACKAGE

摘要

PURPOSE: A method for fabricating a stacked semiconductor chip package is provided to prevent a unit semiconductor chip package from being damaged by a molding process of a leadframe by stacking the unit semiconductor chip package after the leadframe is firstly molded. CONSTITUTION: Adhesive(45) is applied to the bottom of the first leadframe(41) that is reversed to make a curved part of an exposed land faces upward. The first unit semiconductor chip package(43) is reversed to be mounted in a backward direction and a heat treatment process is performed in an oven to bond the bottom of the first leadframe to the top of the first unit semiconductor chip package. An air cooling process is performed. The first leadframe and the first unit semiconductor chip package that are bonded to each other are reversed to be mounted in a forward direction. Adhesive(48) is applied to the top of the first leadframe and the second unit semiconductor chip package(46) is mounted in a forward direction. A heat treatment process is performed in an oven to bond the top of the first leadframe to the bottom of the second unit semiconductor chip package. An air cooling process is performed. A soldering process is performed to electrically connect the land of the first leadframe with the leads of the first and second unit semiconductor chip packages by using an automatic soldering machine.