MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To solve the problem that a semiconductor chip cannot be firmly adhered to a base due to insufficient wetting of an adhesive caused by the warp of the base on which the semiconductor chips are mounted to deteriorate reliability in a conventional manufacturing method of a semiconductor device. SOLUTION: The base having the warp is corrected to a proper shape by curing the adhesive and a sealing resin at the same time under pressure for compressing and curing the sealing resin. The insufficient wetting of the adhesive is dissolved to firmly fix the semiconductor chip on the base. Thereby the semiconductor device having excellent reliability can be achieved by a simple process. COPYRIGHT: (C)2003,JPO