发明名称 PROCESS FOR DRILLING CIRCUIT BOARD PANELS
摘要 Drill stacks and methods of drilling holes in drill stacks. A preferred method of drilling one or more holes in a stack of panels (230, 240, 250) wherein each panel of the stack of panels includes at least one conductive layer (233, 235, 243, 245, 253, 255) and at least one dielectric layer (232, 236, 242, 246, 252, 256), includes: (a) providing a stack of panels (230, 240, 250), a laminate spacer (220), and an entry layer (210); (b) providing a laminate spacer; providing an entry layer (210); forming a drill stack by sandwiching the laminate spacer (220) between the entry material and the stack of panels (230, 240, 250); and (c) drilling a hole (201) that passes through the entry layer (210) and laminate spacer (220) and at least partially through the stack of panels. A preferred drill stack (230, 240, 250) includes a stack of non-woven aramid skinned panels and at least one epoxy resin impregnated woven glass and metal laminate sandwiched between an entry layer and a backer board (260). Another preferred drill stack includes at least three aramid skinned, mechanically drilled panels (230, 240, 250) comprising at least one through hole (201) passing through all of the at least three panels (230, 240, 250) wherein there is substantially no upheaval of the surface copper surrounding the at least one hole.
申请公布号 WO03077619(A1) 申请公布日期 2003.09.18
申请号 WO2003US06649 申请日期 2003.03.05
申请人 KENNAMETAL INC.;OLSON, ARIC, JOSEPH 发明人 OLSON, ARIC, JOSEPH
分类号 B23B35/00;H05K3/00;(IPC1-7):H05K3/00 主分类号 B23B35/00
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