发明名称 Bonding machine for a substrate
摘要 A bonding machine includes a first feeding device for feeding a substrate, a glue-dispensing device for dispensing glue, a first pair of heating rolls for rolling and heating the substrate passing through it and transferring the glue to the substrate so as to form a glue layer on the substrate, a second feeding device for feeding a cover, and a second pair of heating rolls for bonding the cover with the substrate through the glue layer, thus forming a web. A cooling roll may be located downstream of the third heating roll and the fourth heating roll for cooling the substrate and the cover that have bonded together. A product-collecting reel may be located downstream of the third heating roll and the fourth heating roll for winding the resultant web.
申请公布号 US2003176130(A1) 申请公布日期 2003.09.18
申请号 US20020322837 申请日期 2002.12.18
申请人 LEE CHI-SHIH 发明人 LEE CHI-SHIH
分类号 B32B27/12;B32B37/08;B32B37/20;(IPC1-7):B32B5/22;B32B5/24;B32B5/26 主分类号 B32B27/12
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