| 摘要 |
<p>A semiconductor chip (S) is provided with photodiodes (PD) and output terminals (T) of optical sensing elements. A circuit board (C) is provided with input terminals (I) for receiving signals from the output terminals (T) of the semiconductor chip (S). A connection means (CM) connects the terminals (T) to the respective input terminals (I). The intervals between the input terminals (I) are smaller than those between the output terminals (T). This sensor has a signal reading circuit (A) outside an input terminal formation region (RI) of the circuit board (C), so that the dimensions of the circuit board (C) are made smaller than those of the semiconductor chip (S). Therefore, when sensors (D) are arrayed, the semiconductor chips (S) are disposed close to or in contact with each other, thereby suppressing a decrease in the resolution of a sensor connecting section.</p> |
