| 发明名称 |
Method for processing substrates |
| 摘要 |
A method for processing substrates, in which a photoresist layer is applied and structured on their surface. By blasting the substrate with particles, recesses are put into the surface of the substrate in those areas not covered by photoresist.
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| 申请公布号 |
US6620735(B2) |
申请公布日期 |
2003.09.16 |
| 申请号 |
US20010990070 |
申请日期 |
2001.11.21 |
| 申请人 |
ROBERT BOSCH GMBH |
发明人 |
PINTER STEFAN;HOEFER HOLGER |
| 分类号 |
B24C1/04;B24C3/32;B24C11/00;H01L21/304;H01L21/311;H01L21/48;H01L23/12;H01L23/13;H01L23/64;(IPC1-7):H01L21/302 |
主分类号 |
B24C1/04 |
| 代理机构 |
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代理人 |
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