| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a reduction-type solder apparatus which is inexpensive, is small in size, requires the use of only a small amount of gas, has excellent productivity, and is short in high-temperature holding time of members. <P>SOLUTION: This reduction-type solder joining apparatus includes: a chamber 1 which includes a hydrogen introduction tube 21 and a nitrogen introduction tube 24 and is covered with a movable lid 11 provided with a nozzle 23 for spraying a hydrogen gas on a joint of a member to be joined (e.g. a semiconductor chip 8); a stage 3 with a heater which is housed in the chamber 1 and mounts thereon one of a plurality members to be joined for preheating; a tool head 4 which carries the other member to be joined from the outside of the chamber to a joining position, brings both the members to be joined into contact with each other and quickly heats the members to a solder joining temperature; and a driving mechanism (not shown) for the tool head 4. Spraying the hydrogen gas can stabilize the joint quality, and quick heating by the tool head 4 can shorten the high-temperature holding time and production tact. <P>COPYRIGHT: (C)2003,JPO</p> |
