发明名称 EDGE POLISHING DEVICE AND EDGE POLISHING METHOD FOR DEVICE WAFER
摘要 PROBLEM TO BE SOLVED: To finish the polishing of an edge composed of an upper edge, a lower edge, and an outer circumferential face efficiently, in a short period of time and almost simultaneously, and moreover, to prevent a mutual interference between polishing members for the upper edge, and to reduce the installation area of a polishing device. SOLUTION: This polishing device 10A comprises a pair of upper edge polishing members 13a, 13a' which are arranged to be opposed to each other interposing a chuck means 12 and can be reciprocated in such a manner that they are mutually shifted along the slope of the upper edge 2a of a rotating work 1, a lower edge polishing member 13b which is arranged between the upper edge polishing members 13a, 13a' and can be reciprocated along the slope of the lower edge 2b, and an outer circumferential face polishing member 14a which is arranged between the upper edge polishing members 13a, 13a' and can be reciprocated along the axis of the work 1. Each polishing member is equipped with a loading means 28 for adding polishing pressure. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003257901(A) 申请公布日期 2003.09.12
申请号 JP20020061011 申请日期 2002.03.06
申请人 SPEEDFAM CO LTD 发明人 HAKOMORI SHUNJI
分类号 B24B9/00;H01L21/304;(IPC1-7):H01L21/304 主分类号 B24B9/00
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