| 摘要 |
PROBLEM TO BE SOLVED: To easily manufacture a semiconductor device by which three- dimensional mounting can be achieved. SOLUTION: The method for manufacturing a semiconductor device includes a step (a) for electrically connecting a semiconductor 20 with conductive parts 14 of a substrate 10 by wires 26, a step (b) for providing bumps 30 on electrodes 22 of the semiconductor chip 20 in such a way that they are higher than tops of the wires 26, a step (c) for forming a space 54 of a sealant 40 by sandwiching the substrate 10 and the bumps 30 by molds 50 and 52, and a step (d) for sealing the semiconductor chip 20 by filling the space 54 with the sealant 40 and exposing parts of the bumps 30 which are in contact with the molds 50 and 52 from the sealant 40. COPYRIGHT: (C)2003,JPO
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