COMPOSITION FOR FORMING FILM, METHOD OF FORMING FILM, AND INSULATION FILM OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an insulation film of a semiconductor device which has a low dielectric constant and high heat resistance and has mechanical strength and adhesiveness high enough to be tolerable to a CMP process. SOLUTION: The composition for forming a film contains a modified silicone compound expressed by a general formula (1). COPYRIGHT: (C)2003,JPO