Device with power semiconductor, comprises assembly frame and metal block as substrate for semiconductor component encapsulated by moulded resin

摘要

The device comprises a semiconductor component (1) with upper and lower surfaces carrying the main electrodes (1a,1b) and the signal electrode (1c), a metal block (15) as a substrate for the semiconductor component, the assembly frames (6,7,13), a casing (14) of moulded resin covering in a single piece the semiconductor component, the metal block, and the assembly frames, and a heat sink (16). The assembly frames (6,7) are connected to the main electrodes (1a,1b), respectively, the former by the intermediary of a part of the metal block (15), and the assembly frame (13) is connected to the signal electrode (1c) by the intermediary of an aluminum wire (9). The moulded resin surrounding the assembly frames and the semiconductor component reinforces the joint and improves the resistance to failure by fatigue in the connecting parts of the assembly frames. Parts (6b,7b) of the assembly frames (6,7) are bare at the exterior of the casing (14) and have the role of external electrodes which are laid out projecting with respect to the main surface (14c) of the casing (14) in a direction perpendicular to the metal block (15). The moulded resin has the coefficient of thermal expansion different from that of the metal block (15) by not more than +/- 20%. In the second embodiment, the external electrodes are placed on the parts of the casing projecting in a direction perpendicular to the metal block. In the third embodiment, the external electrodes are placed on points situated towards the interior of the casing and soldered to the parts of the assembly frames. In the fourth embodiment, the metal block is with projecting elements provided to improve the adhesion of moulded resin. In the fifth embodiment, a part of the assembly frame is left bare at the level of the main surface of the casing. In the sixth embodiment, another metal block is fastened to the part of the assembly frame left bare. In the seventh embodiment, both metal blocks are with spaces for a refrigerant. In the eighth embodiment, a set of several, in particular three, devices are connected and encapsulated in a single piece by molded resin.