| 摘要 |
PROBLEM TO BE SOLVED: To provide an image pickup device capable of performing correction coping with an increase in flaws by the secular change of a solid-state image pickup device and temperature rise by detecting an image defect position on the solid-state image pickup device and occasionally updating the detection position information. SOLUTION: A flaw detecting part 25 at an AGC (automatic gain control) on detects a flaw by a defective pixel when the amplification factor of a gain amplifier becomes very high, and outputs a first correction signal. A preset data correction signal generating part 26 compares the positional information of a video signal with the positional information of a flaw from an external semiconductor memory 12, ascertained at product shipping, and generates a second correction signal when the positional information coincide with each other. An additionally generated flaw correction signal generation circuit 27 outputs a third correction signal when the positional information of a flaw detected as a newly generated one from an internal register of a 64-pixel sampling flaw detection circuit 28 is inputted. A signal selecting part 23 selects an interpolation signal from an interpolation signal generating part 22 when the first to third correction signals are inputted. COPYRIGHT: (C)2003,JPO
|
