| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method, capable of properly keeping the joint between a pad and an IC chip or printed board. SOLUTION: First, FC pads (FLIP CHIP) 11 and BGA (BALL GRID ARRAY) pads 13, which are arrayed on a surface of a board body 10, are cleaned with a sulfuric acid, oxides on the pads 11, 13 are removed. Then, solder pastes 41 are printed on the FC pads 11 directly, and then the solder pastes 41 are printed on the BGA pads 13 directly. Then, the solder pastes 41 that are printed on the pads 11, 13 are reflowed, solder bumps 18 are formed on the surfaces of the FC pads 11, and solder layers 19 are formed on the surfaces of the BGA pads 13. COPYRIGHT: (C)2003,JPO
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