| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus which has a high degree of freedom in selection of an installation site while being capable of maintaining the inside of a furnace extremely clean, with the temperature of a wall of the furnace being low. SOLUTION: A heat treatment apparatus comprises a jig to mount a semiconductor substrate, a housing which stores the jig and the semiconductor substrate and forms a reaction chamber, a reaction gas introduction means for supplying a reaction gas into the housing, a heater provided around the housing, a partition wall which is provided between the heater and the housing and forms a sealed space together with the housing, a cooling medium introduction means for introducing a cooling medium into the sealed space between the partition wall and the housing, a cooling medium exhaust means for exhausting the cooling medium from the sealed space, and a temperature control means for controlling the wall face temperature of the housing. COPYRIGHT: (C)2003,JPO
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