发明名称 |
ONIUM-CONTAINING CMP COMPOSITIONS AND METHODS OF USE THEREOF |
摘要 |
The present invention provides a chemical-mechanical polishing (CMP) composition suitable for polishing semiconductor materials. The composition has a pH of about 5 or less and comprises colloidal silica, at least one onium compound selected from the group consisting of a phosphonium salt, a sulfonium salt, and a combination thereof, and an aqueous carrier therefor; A CMP method for polishing a surface of a semiconductor material utilizing the composition is also disclosed. |
申请公布号 |
EP2069452(A1) |
申请公布日期 |
2009.06.17 |
申请号 |
EP20070837904 |
申请日期 |
2007.09.07 |
申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
WHITE, MICHAEL;CHEN, ZHAN |
分类号 |
C09K3/14;C09G1/02;H01L21/3105 |
主分类号 |
C09K3/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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