| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a lead-free chip-type fixed resistor which is formed as the protection of a global environment is taken into consideration, equipped with an electrode layer, a resistor layer, and a pre-coating layer which are formed through a single burning process, provided with mutual diffusion layers each interposed between the above layers, hardly varied in resistance after it undergoes a thermal cycle test, a deterioration with time, an ON/OFF cycle test, and a laser trimming, and is much improved in yield. <P>SOLUTION: The pre-coating layer is formed of glass composed of 1 wt.% or below alkaline metal, 25 to 40 wt.% silica, 30 to 43 wt.% BaO, 5 to 7 wt.% ZnO, 4 to 7 wt.% Al<SB>2</SB>O<SB>3</SB>, and 10 to 30 wt.% Bi<SB>2</SB>O<SB>3</SB>, wherein the glass composition is analyzed through an atomic absorption method (AA method). The electrode layer, the resistor layer, and the coating layer are successively formed on an insulator base and burned at the same time, whereby the mutual diffusion layer is formed on an interface between the electrode layer and the resistor layer or between the resistor layer and the coating layer. <P>COPYRIGHT: (C)2003,JPO</p> |
