发明名称 |
Flux for solder paste and solder paste |
摘要 |
The flux for solder paste containing dicarboxylic acid of carbon number 3 to 5 and dicarboxylic acid of carbon number 15 to 20 as an activator, which prevents the skinning or changes by aging of viscosity. And at the actual use, the solder paste of the present invention can maintain good coating and printing ability for long time, further can endure the preheating under high temperature.
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申请公布号 |
US2003168123(A1) |
申请公布日期 |
2003.09.11 |
申请号 |
US20030349283 |
申请日期 |
2003.01.22 |
申请人 |
WADA KENICHI;NAKAJI SHOICHI |
发明人 |
WADA KENICHI;NAKAJI SHOICHI |
分类号 |
B23K35/363;B23K35/02;B23K35/26;B23K35/36;C22C13/00;(IPC1-7):B23K35/34 |
主分类号 |
B23K35/363 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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