| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an alkali-developable solder resists resin composition having excellent suitability to set to touch after temporary drying, development life and photosensitivity and giving a cured coating film having excellent adhesion, electric insulation, resistance to the heat of soldering, solvent, alkali and acid and plating required for a solder resist and to provide a cured body of the composition. <P>SOLUTION: The solder resist resin composition comprises an unsaturated group-containing polycarboxylic acid resin (A), a photopolymerization initiator (B), an organic solvent (C), a ≥8C alkyl (meth)acrylate (D), a polyfunctional (meth)acrylate (E) and a polyfunctional epoxy resin (F). <P>COPYRIGHT: (C)2003,JPO |
